Development of an on-chip Interferometer module with small footprint and easy-to-use interfaces for versatile use in various optical sensing applications.
Project Partners:
Vario-optics ag – implementation partner, Vario-optics designs and manufactures photonic circuits based on planar polymer waveguides
OST Buchs Institute for Microtechnology and Photonics – consulting research partner, strong competences in photonic packaging and microassembly
VIVIOR AG, Anja Starke
Swiss Queen GmbH, Michela Mastropietro
CEDES AG, Martin Hardegger
HUBER+SUHNER AG, Matthias Bleibler
Thoratec Switzerland GmbH, Stephan Rupp
Swisens AG, Erny Niederberger
AAA Assemblage Acoustique Azau, Csaba Azau
No-Touch Robotics GmbH, Marcel Schuck
IngStaff GmbH, Mehmet Demirel
Oryl Photonics SA, Orly Tarun
FHNW, Bojan Resan
ZHAW, Dirk Penner
FH OST, Oliver Fähnle
xirrus GmbH, Lukas Schuler
SUSS MicroOptics SA, Toralf Scharf
Synova SA, Jeremie Diboine
Infrascreen, Benoit de Combaud
RhySearch Optical Coating, Heidi Thomé
XENLUX AG, Philippe Morel
Photonics Booster
c/o Swissmem
Pfingstweidstrasse 102
Postfach
CH-8037 Zürich
T +41 44 384 42 10
Your registration has been successfully submitted! We’re thrilled to have you join us for the event.
If you have any questions, feel free to reach out to us at:
Phone: +41 44 384 42 10
Email: photonics@swissmem.ch